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September 6, 2017 - One Day Workshop

Best Practices for Improving Manufacturing Productivity

Date: Wednesday September 6 2017

Time: 8.30 am registration for 9.00 start   Finish 4.45 pm approx


You have the responsibility and resources to improve the productivity of an assembly operation….what do you do?

This workshop drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. It will cover general optimization objectives and strategies for improving productivity and quality. Best Practices are defined and applied to the most critical assembly operation, stencil printing of solder paste. Also addressed are the assembly process operations of Component Placement, Soldering, and Cleaning In addition, Best Practices evolving for the implementation of Challenging Technologies such as BTC/QFN’s are presented. A comprehensive perspective on problem issues is developed for the most currently critical materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This workshop is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.

What You Will Learn:
Topics Covered: Optimization objectives • Getting the most productivity from an existing line • Definition of "best practices" • Best practices in the assembly process • Solder paste printing process best practices • Component placement best practices • Reflow soldering best practices • Wave and selective soldering best practices • Best practices concerning "challenging technologies" • QFNs • Ultra-miniature components (0201s, 01005s, ultra-fine pitch BGAs and CSPs

Who Should Attend:
This course is intended for manufacturing process design test and quality engineering personnel, as well as management who are involved in the production of surface mount or mixed technology assemblies and want to improve their processes practices methodologies equipment materials and productivity.

The Presenter:

Phil Zarrow is the President and Principal Consultant for ITM Consulting and has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, he was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Mr. Zarrow formed ITM Consulting in 1993 and has helped countless companies in all aspects of PCB Design and Assembly. He is a popular speaker and workshop instructor. He has chaired and instructed numerous seminars and conferences in many countries. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions" and holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.

Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront"and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update’s “Boardtalk” audio program.