September 7, 2017 - Half day workshop
Implementing Advanced “Leading Edge” and “Bleeding Edge” SMT Component Technology
Date: Thursday September 7, 2017
Time: 1.15 pm registration for 1.30 pm start Finish 4.30 pm approx
REGISTRATION CODE: PZ3
The circuit board assembler is constantly challenged by components that seem to defy logic and manufacturability. Passives such as 0201s and 01005s, while bringing happiness to the designer with regard to layout densities are the bane of the assembler. IC packaging also has adhered to the mantra of “smaller, faster” taunting the assembler with land-grid arrays (or no lead packages) and high-density CSPs and Flip-chips. Yet, manufacturing PCBAs with these “bleeding edge” components is not insurmountable, (though not for the weak of heart).
This workshop discusses practical approaches in dealing with the most challenging of component packages. Optimizing the SMT assembly process, as it pertains to very small and high-density components will be covered. The impact of lead-free and RoHS compliance will, of course, also be discussed. Case studies based upon the instructor’s experience will be presented.
Bottom Terminated Components (BTCs)
- QFN, SON, LGA, etc
- BTC Advantages
- BTC Challenges
- Center Pad Issues
- Reliability Issues
- Voiding and “Avoiding the Void”
- Stencil and Window Pane Considerations
- PCB approaches
- Solder approaches
- Reflow considerations
Ultra-fine Pitch ICs
- 0.5, 0.4 and 0.3mm Challenges
- Ultra-fine Pitch Components
- 0201, 01005 and 008004 Implementation Challenges
- Design issues
- PCB Fabrication issues
- Assembly Process Issues
Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount assemblies.
Phil Zarrow is the President and Principal Consultant for ITM Consulting and has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, he was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.
Mr. Zarrow formed ITM Consulting in 1993 and has helped countless companies in all aspects of PCB Design and Assembly. He is a popular speaker and workshop instructor. He has chaired and instructed numerous seminars and conferences in many countries. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions" and holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront"and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update’s “Boardtalk” audio program.