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September 6, 2017

One Day Workshop: 

Flexible and Rigid Flex Circuits - Design, Assembly and Quality Assessment

Date: Wednesday September 6, 2017

Time: 8.30 am registration for 9.00 start   Finish 4.45 pm (approx.)


This full day program focuses on the implementation of design principles for flexible and rigid flex circuits, alternative fabrication methodologies and planning for assembly process efficiency. Information presented will include the selection criteria for base materials, general quality expectations, assessment of alternative fabrication methodologies and basic requirements for accommodating SMT-on-flex assembly processing. The material presented will detail specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The instructor will also furnish practical flex circuit DfM benchmarks for ensuring end product quality, reliability and maximizing manufacturing efficiency.

Topics of discussion:

  1. Applications, standards and defining product use environments
  2. Designing flexible and rigid-flex circuits (IPC-2223)
  3. Flex circuit construction alternatives
  4. Flex and Rigid Flex circuit fabrication process variations
  5. SMT component selection and land pattern development
  6. Specifying base material, plating and coating
  7. Fabrication quality assessment (IPC-A-610 and IPC-6013)
  8. Assembly process implementation

Who Should Attend:

This tutorial has been developed to furnish the design professionals, systems engineers, assembly and test engineering specialists with a thorough understanding of the materials, fabrication process variations and preferred design practices for flexible and rigid-flex circuits. In addition, the requirements for automated SMT assembly will be defined and include detailed guidance regarding panel planning and accommodating current assembly process variations.

The Presenter:

Vern Solberg is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the electronics industry for more than thirty years in areas related to both commercial and aerospace electronic product development and is active as an author and educator. Mr Solberg holds several patents for IC packaging innovations including the multiple die and folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication.  Mr Solberg's last visit to Australia was received with great acclaim by all who attended and we are delighted he is able to again participate at the SMCBA conference.

Mr. Solberg has been involved with the training of both students and faculty members at the University of Wisconsin, School of Engineering in Milwaukee and Kansas State Universities Microelectronic Laboratory in Salina. He also participates in and supports several industry organizations including SMTA, IEEE, IMAPS and IPC developing electronic industry related standards. Vern is also a member of the IPC organizations Ambassadors Council as well as a Certified IPC Trainer for IPC-A-600 and IPC-A-610.

Current IPC standards development activity-

  • Chairman- IPC-7094, ‘Design and Assembly Process Implementation for Flip Chip and Die Size Components’
  • Co-chair- IPC-7093, ‘Design and Assembly Process Implementation for Bottom Terminal Components (SON and QFN)’.
  • Co-chair- IPC-7092, ‘Design and Assembly Process Implementation for Embedded Components’.
  • Co-chair- IPC-7091, ‘Design and Assembly Process Implementation for 3D Semiconductor Package Technology’