SMT BOOT CAMP 2019

A comprehensive two day workshop covering everything

you need to know about SMT Electronics Assembly

Presented by: Phil Zarrow

– President and Principal Consultant, ITM Consulting

The SMT Boot Camp is an SMT Electronics Assembly workshop will give a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day workshop providing attendees with the opportunity to learn and understand the processes, tools, and materials used in today's manufacture of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing and related fields for over 35 years. Mr Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. He has presented technical papers at major conferences in North and South America, Europe, South Africa, Australia and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions".

See course outline below.

When and Where:

Thursday 7 & Friday 8 November – Matthew Flinders Hotel, 667 Warrigal Road, Chadstone - MELBOURNE

Monday 11 & Tuesday 12 November – Michael’s Conference Centre, 223 Padstow Rd, Eight Mile Plains - BRISBANE

Thursday 14 & Friday 15 November – Marriott Courtyard North Ryde, 7-11 Talavera Rd, North Ryde - SYDNEY

Wednesday 20 & Thursday 21 November – Jet Park Hotel near Auckland Airport, 63 Westney Road, Mangere – AUCKLAND

For further information contact Andrew Pollock on Tel: 61 3 9571 2200 or email to This email address is being protected from spambots. You need JavaScript enabled to view it.

smt boot camp 2019 COURSE OUTLINE

DAY ONE

INTRODUCTION

PCB FABRICATION OVERVIEW

1. Circuit board manufacture overview
2. Surface finish
3. Legend

SMT ASSEMBLY

• Solder paste

1. Nomenclature
2. Manufacture
3. Solder characteristics
4. Flux
5. Solder Paste considerations

• Stencil Fabrication and Design

1. Chemical etch
2. Laser cut
3. Electroplating
4. Aperture Design rules
5. Special Aperture

• Solder Paste Printing

1. Dispensing options
2. Fiducials
3. Solder deposition
4. Process parameters
5. Process considerations

DAY TWO

• Component placement

1. Machine types
2. Feeder types
3. Placement considerations

• Reflow

1. Reflow Oven types
2. Vapor Phase
3. Profile development
4. Reflow considerations

• Wave Soldering

1. Machine types
2. Profile development
3. Process considerations

• Selective Soldering

1. Machine types
2. Profile development
3. Process considerations

• Cleaning

1. Contaminants and Corresponding Solvents
2. Effectiveness of Aqueous Detergents
3. Cleaning Equipment (Batch and in-line systems)
4. Cleanability of Components
5. Driving Forces For No Clean
6. Cleaning No Clean

• Testing

1. Testing and Controlling the process through SPC
2. Inspection points and strategies in the process
3. AOI
4. XRAY
5. Testing considerations

Questions and Answer Session

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Accommodation:

There are hotels near to each venue - if you require accommodation please email us on This email address is being protected from spambots. You need JavaScript enabled to view it. and indicate for which venue you need accommodation information.